- 品牌:
-
- Comair Rotron (1)
- Wakefield-Vette (1)
- 冷却封装:
-
- 离基底高度(鳍片高度):
-
- 不同温升时功率耗散:
-
- 不同强制气流时的热阻:
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- 自然条件下热阻:
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- 材料镀层:
-
17 条记录
图片 | 型号 | 品牌 | 描述 | 价格 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|---|
Seeed Technology Co., Ltd | ULTRATHIN HEAT S... |
-
|
1 | 580 | 提交询价 | |||
Advanced Thermal Solutions Inc. | HEATSINK TO-220 HO... |
-
|
1 | 580 | 提交询价 | |||
Comair Rotron | HEATSINK STAMP 9.... |
-
|
1 | 580 | 提交询价 | |||
CTS Electrocomponents | HEATSINK HORZ .375... |
-
|
1 | 580 | 提交询价 | |||
CTS Electrocomponents | HEATSINK VERT .375... |
-
|
1 | 580 | 提交询价 | |||
CTS Electrocomponents | HEATSINK VERT .187... |
-
|
1 | 580 | 提交询价 | |||
Advanced Thermal Solutions Inc. | HEATSINK TO-220 LO... |
|
1 | 2,141 | 加入购物车 提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
10,000 | 580 | 加入购物车 提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | HEAT SINK 1.75" HIG... |
|
1 | 3,139 | 加入购物车 提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
15,000 | 580 | 加入购物车 提交询价 | |||
t-Global Technology | PH3N NANO 76.2X19.1X0... |
|
1 | 27 | 加入购物车 提交询价 | |||
t-Global Technology | PH3N NANO 76.2X19.1X0... |
|
1 | 82 | 加入购物车 提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1 | 20,025 | 加入购物车 提交询价 | |||
Wakefield-Vette | HEATSINK TO-220 LO... |
|
1 | 2,534 | 加入购物车 提交询价 | |||
Assmann WSW Components | HEATSINK TO-220 19.0... |
|
1 | 6,751 | 加入购物车 提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 2.5W... |
|
1 | 5,941 | 加入购物车 提交询价 | |||
t-Global Technology | PH3 76.2X19.1X0.21MM |
|
1 | 319 | 加入购物车 提交询价 |